Universal Interface Board

Universal Interface Board

1. Work Temperature: -40°C~70°C;
2. Storage Temperature: -55°C~125°C;
3. Power Consumption: ≤35W.

Universal Interface Board

Universal Interface Board

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    Universal Interface Board

    Product Profile

    The ER-DSPB-3U1 board is a universal interface board of “ER-DSPC-20A”, which meets the Open VPX platform standard. It provides LVDS interface for SAR image transmission, multi-channel Rapid IO high-speed communication interface, echo recording interface, multi-channel 422/TTL control interface. The board can provides hardware support for high-speed real-time signal processing tasks such as sonar, instrumentation and medical electronics.

    Technical IndicatorsUniversal Interface Board function block diagram

    Processing Capacity:

    1 piece HXDSP1042 computing power 84G FLOPS

    1 piece XC7K325T processing capacity: 840 DSP48E1 Slices

    Storage Capacity:

    DSP external DDR3 memory, total capacity: 2GBytes

    DSP chip external 128Mb SPI NOR FLASH, used for DSP Boot

    Transmission Bandwidth:

    DSP 4x Rapid IO connects to FPGA implementation and external data exchange single line rate 5Gbps.

    Slow Interface:

    The DSP is debugged and updated by the network port. The serial LVDS interface is used for image transmission of dedicated coding chips such as MAX9247 and Si8660.


    The board has power-on self-test, function detection and temperature monitoring functions. The fault can be located on the main chip, and the DSP program can be updated through the network and Rapid IO

    Physical Characteristics:

    Size: Standard 3U board

    Work Temperature: -40°C~70°C

    Storage Temperature: -55°C~125°C

    Power Consumption: ≤35W

    Heat-dissipating Method: Cooling Conduction


    Application Techniques

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