Universal Interface Board

Universal Interface Board

ER-DSPB-3U1
1. Work Temperature: -40°C~70°C;
2. Storage Temperature: -55°C~125°C;
3. Power Consumption: ≤35W.

Universal Interface Board

Universal Interface Board

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    Universal Interface Board

    Product Profile

    The ER-DSPB-3U1 board is a universal interface board of “ER-DSPC-20A”, which meets the Open VPX platform standard. It provides LVDS interface for SAR image transmission, multi-channel Rapid IO high-speed communication interface, echo recording interface, multi-channel 422/TTL control interface. The board can provides hardware support for high-speed real-time signal processing tasks such as sonar, instrumentation and medical electronics.

    Technical IndicatorsUniversal Interface Board function block diagram

    Processing Capacity:

    1 piece HXDSP1042 computing power 84G FLOPS

    1 piece XC7K325T processing capacity: 840 DSP48E1 Slices

    Storage Capacity:

    DSP external DDR3 memory, total capacity: 2GBytes

    DSP chip external 128Mb SPI NOR FLASH, used for DSP Boot

    Transmission Bandwidth:

    DSP 4x Rapid IO connects to FPGA implementation and external data exchange single line rate 5Gbps.

    Slow Interface:

    The DSP is debugged and updated by the network port. The serial LVDS interface is used for image transmission of dedicated coding chips such as MAX9247 and Si8660.

    Other:

    The board has power-on self-test, function detection and temperature monitoring functions. The fault can be located on the main chip, and the DSP program can be updated through the network and Rapid IO

    Physical Characteristics:

    Size: Standard 3U board

    Work Temperature: -40°C~70°C

    Storage Temperature: -55°C~125°C

    Power Consumption: ≤35W

    Heat-dissipating Method: Cooling Conduction

     

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