ER-GM-4B0 Full System Full Frequency Point RTK Positioning Module
ER-GM-4B0 Full System Full Frequency Point RTK Positioning Module is the world’s smallest high-precision positioning module based on the Nebulas-II high-precision SoC chip. It supports BDS B1/B2/B3, GPS L1/L2/L5, GLONASS L1/L2, Galileo E1/E5a/ E5b, QZSS L1/L2/L5 and other satellite signals.
The product supports combined navigation of narrow-band anti-jamming and inertial navigation equipment, and its applications are mainly for light robots, GIS information collection, intelligent driving, unmanned aerial vehicles, etc.
ER-GM-4B0 uses a single Nebulas-II baseband chip and a single high-precision RF chip, with the highest integration in the industry. It has realized the world’s first full-system full-frequency RTK surface-mount module in a 30x40x4mm volume, which can significantly reduce the terminal volume.
New generation Nebulas-II SoC chip
ER-GM-4B0 uses a new generation full-system multi-core high-precision SoC chip-Nebulas-II. This chip is based on the mature Nebula baseband chip core technology, supports 432 channels, built-in broadband ADC and anti-interference unit, integrates two 600MHz ARM processors and dedicated high-speed floating-point arithmetic processors to provide more powerful satellite navigation signal processing ability.
Full system full frequency RTK engine
ER-GM-4B0 uses a full system full-frequency point RTK engine, which can simultaneously process the multi-frequency observation data of satellite systems such as BDS, GPS, GLONASS, GALILEO, etc., making full use of the unique three-frequency of BDS, GPS, and Galileo satellite systems.
The advantages significantly improve the initialization speed, measurement accuracy, and reliability of RTK in difficult environments such as urban blocks and shades, and achieve long-baseline centimeter-level RTK positioning.
Gypsophila RTK processing technology
The new generation of Gypsophila RTK processing technology makes full use of the high-performance data sharing function and ultra-simplified operating system in the Nebulas-II chip to fully optimize the multi-dimensional RTK matrix pipeline calculation. The RTK processing capacity is increased by more than 80% and the stability is achieved. 30 More than one RTK positioning solution and re-acquisition time within 1s.
Autonomous MEMS Integrated Navigation
ER-GM-4B0 integrates a 6-axis MEMS chip and uses a mature and reliable U-Fusion integrated navigation algorithm, which can effectively solve problems such as the interruption of positioning results caused by satellite signal loss of lock, and further optimizes the determination in complex environments such as buildings, tunnels, and viaducts. The positioning of the output to the output greatly improves the continuity and reliability of the output data.
30×40mm industry’s smallest full system multi-frequency high-precision positioning directional surface-mount module
New Nebulas-II high-performance SoC chip
Full system multi-frequency RTK
Supports up to 20Hz data output rate
Integrated 6-axis MEMS chip, autonomous integrated navigation
Advanced multipath suppression technology
Centimeter-level high-precision RTK positioning
Serial, SPI, 1PPS, Event and other physical interfaces
Support RTC hot start
RTCM format adaptive recognition
Smart driving test
|Aisle||432 channels based on Nebulas-II chip|
|Frequency||BDS B1/B2/B3, GPS L1/L2/L5, GLONASS L1/L2, Galileo E1/E5b/E5a|
|Single point positioning (RMS)||Plane: 1.5m Elevation: 3.0m|
|DGPS (RMS)||Plane: 0.4m Elevation: 0.8m|
|RTK (RMS)||Plane: 1.0cm+1ppm Elevation: 1.5cm+1ppm|
|Hot start time||<10s|
|Cold start time||<25s|
|Initialization time||<5s (typical value)|
|Differential data||RTCM 2.X/3.X CMR|
|Data format||NMEA-0183, Unicore|
|Data update rate||20Hz|
|Positioning update rate||20Hz|
|Timing accuracy (RMS)||20ns|
|Orientation accuracy (RMS)||0.03m/s|
|Inertial navigation accuracy||<5%×driving distance (no GNSS signal)|
|Observation accuracy (RMS)||BDS||GPS||GLONASS||Galileo|
|B1/L1 C/A/E1 code||10cm||10cm||10cm||10cm|
|B1/L1/E1 carrier phase||1mm||1mm||1mm||1mm|
|B2/L2P(Y)/L2C/E5b carrier phase||1mm||1mm||1mm||1mm|
|B3/L5/E5a carrier phase||1mm||1mm||1mm||1mm|
|Hardware interface||2×30 surface mount|
|Voltage ripple||100mV p-p(max)|
|LNA power output||4.75~5.0V, 0~100mA|
|Power consumption||1.8W (typical)|
|3xUART (LVTTL), 1x1PPS (LVTTL), 1xEvent, 1xSPI, 1x I2C|